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Advanced Electronics Packaging Digest

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Four Scientists Recognized for Innovations in Flexible Electronics and Superwood

11/11/2026 | Hebrew University
Hebrew University hosted two days of celebrations and scientific exchange recognizing advances in nanotechnology with potential applications in medicine, quantum computing, energy and advanced materials.

Infineon Achieves World-First 300mm SiC Wafer Milestone

11/11/2026 | Infineon
Infineon Technologies AG has successfully processed 300-millimeter silicon carbide wafers into functional power devices at its fab in Villach, Austria.

Real Time with... SMTAI 2026: Heller's Innovation in Vacuum Technology

11/10/2026 | Real Time with...SMTAI
To address voiding issues, Heller Industries has developed a state-of-the-art vacuum technology, which includes its short-cycle vacuum oven. In this interview, Caleb Eagle explains the evolution of this technology, emphasizing that the company began by designing a traditional vacuum oven. However, to keep up with throughput demands, Heller introduced the short-cycle vacuum system.

Foxconn Showcases Pearl Satellites and Communications Technologies at TASTI 2026

11/09/2026 | Foxconn
Foxconn Technology Group is showcasing its latest developments in next-generation satellite communications at the Taiwan International Assembly of Space Science, Technology, and Industry (TASTI 2026), held November 8-10 at the Greater Tainan Convention and Exhibition Center.

SCHMID Wins Wet-Process Equipment Order for South Asia’s First Glass Core Facility

11/09/2026 | SCHMID Group
Order marks an important step on the industry’s path from pilot lines to volume manufacturing of glass core substrates for AI and high-performance computing.
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