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Advanced Electronics Packaging Digest

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GlobalFoundries, Commerce Finalize $375M Quantum R&D Award

09/14/2026 | GlobalFoundries
GlobalFoundries (GF) announced it has finalized a definitive agreement with the U.S. Department of Commerce’s CHIPS Research and Development Office for a $375 million award for research and development to accelerate the company’s Quantum Technology Solutions (QTS) business, designed to help scale domestic quantum semiconductor manufacturing and strengthen the United States’ leadership in quantum technologies.

STANIA, Asahi Solder Partner to Strengthen Indonesia’s Tin Downstreaming

09/14/2026 | STANIA
PT Solder Tin Andalan Indonesia (STANIA), a subsidiary of PT Arsari Tambang, and Singapore Asahi Chemical & Solder Industries Pte. Ltd. (Asahi Solder) have signed a Memorandum of Understanding (MoU) to strengthen Indonesia’s tin downstreaming industry through the development of higher-value solder products, enhanced technology and quality capabilities, and expanded market access.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/11/2026 | Marcy LaRont, I-Connect007
I feel compelled to start off by recognizing that today marks the 25th anniversary of the tragic activities that took place on 9/11/2001. Like so many of us, I will never forget exactly where I was and what I was doing when I heard that United flights 11 and 175 had struck the World Trade Center in NYC. That day, the world was forever changed, and the effects still reverberate. Today, I am taking a moment to remember the lives lost and the heroism and coming together that day brought about. 

Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.

AI Drives High-End IC Substrate Growth to US$19.51B in 2026

09/10/2026 | TPCA
As demand for generative AI, high-performance computing (HPC), and data center infrastructure continues to accelerate, the global IC substrate industry is entering a new phase characterized by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.
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