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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Zuken Innovation World 2016 Submission Deadline Draws Near
December 2, 2015 | ZukenEstimated reading time: Less than a minute
Time’s running out to submit your presentation for Zuken Innovation World 2016, to be held April 18-20, 2016 in San Diego. This year's theme is Zuken University, with a shift toward classroom-style interactive sessions with smaller audiences. A session can range from design tutorials to emerging trends. Please submit your session topic today, before time runs out.
Call for Presentations Guidelines
• The deadline for final submission is December 11, 2015.
• Zuken users, partners, technologists and invited guests may submit a proposal for a presentation at Zuken Innovation World 2016. You may present more than one presentation, however, you must submit a separate proposal for each.
• Presentations are 30 minutes in length.
• A submission requires a Presentation title (10 words or less) and Presentation summary (150 words)
• Summaries should contain enough detail to clearly convey the material to be covered during the presentation. Be sure to include information about what attendees should expect to gain by attending.
• Government and company clearance to present and publish should be final at the time of submission.
• Summaries and biographies may be edited for the printed program to accommodate length requirements or to improve readability.
To submit your presentation, click here.
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July 2025 PCB007 Magazine: Sales—From Pitch to PO
07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.