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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
December 7, 2015 | IPCEstimated reading time: 3 minutes
The reactivated D-22 High Speed/High Frequency Design Subcommittee met to review an initial draft of IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards. While agreed that the document is not intended to be used as a stand-alone document (it will support the IPC-2221B, Generic Standard on Printed Board Design), the initial draft does contain a substantial amount of “how-to 101” tutorial information for the designer as taken from the older IPC-2252, Design Guide for RF/Microwave Printed Boards. It was decided that IPC should conduct an open-ended industry survey that asks two basic questions to help steer the course of the IPC-2228:
- If a printed board fabricator switched up a job from an FR-4 board (IPC-6012) to an RF board (IPC-6018), what things would the fabricator need to focus on for that job (e.g. drilling, plating and marking)?
- What elements of fabrication and assembly are different between traditional rigid printed boards and RF printed boards that IPC should focus on (e.g. sequential lamination, back drilling and material handling)?
The D-22 High Speed/High Frequency Performance Subcommittee met to complete the process of reviewing and providing disposition to industry comments submitted during the summer 2015 Final Draft circulation of IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards. The document will now be prepared for official balloting and a corresponding IPC-6018CS Space and Military Avionics Applications Addendum will also be drafted for a 2016 release.
The D-24a TDR Test Methods Task Group met to review the status of the Gage R&R Validation Program for the forthcoming “B” Revision to IPC-TM-650, Method 2.5.5.7, Characteristic Impedance of Lines on Printed Boards by TDR.
The D-24b Bereskin Test Methods Task Group met to review two different industry approaches to addressing the Bereskin stripline resonator test method that lends itself to the test and measurement of Dk and Df of thin dielectric materials up to 20 GHz. An IPC-TM-650 Test Method could be developed that provides both procedures as Methods A and B.
The D-24c High Frequency Test Methods Task Group meet to review data from five participating companies in a round robin test program that will assess the state-of-the-art of test material provides and testing labs in the measurement of dielectric properties of materials at frequencies above 10 GHz. A variety of test methods are being utilized based on current practices utilized in commerce.
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05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
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Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
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