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Seeking a New Generation of Light-based Sensing Systems
December 7, 2015 | DARPAEstimated reading time: 3 minutes
The first phase of the program calls for researchers to develop the fundamental devices that will underlie the new LIDAR concept: speck-sized light-emitting and light-detecting cells capable of being readily integrated into larger arrays using typical semiconductor manufacturing processes. Phase 2 and Phase 3 of the project call for the integration of these cells into a 1 cm2 array and a 10 cm2 array comprising upwards of 100 and 10,000 unit cells, respectively.
With an integration of digital, electronic, optical and radiofrequency elements on a variety of combined semiconductor materials, the final 10-cm aperture LIDAR surface has the potential to be the most complex electronic-photonic circuit ever constructed, according to an anticipated Broad Agency Announcement of the MOAAB project, to be published later this month on FedBizOpps. As a first step on the way toward the new technology, DARPA will host a Proposers Day event at DARPA headquarters in Ballston, VA, on December 17, 2015, to provide potential proposers with detailed information on the objectives of the program. Details about the Proposers Day can be found in a Special Notice released today.
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