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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Rogers Files Patent Infringement Lawsuits Against KCC
December 7, 2015 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation, today announced that its wholly owned subsidiary, Rogers Germany GmbH, has filed two separate patent infringement lawsuits in Mannheim, Germany against KCC Corporation of Seoul, Korea and its German subsidiary KCC Europe GmbH with its registered office in Cologne. In these two complaints, Rogers alleges that KCC infringes a Rogers patent by offering in Germany direct bonded copper (DBC) substrates that were manufactured using a process that is patented in Germany (European Patent No. 1 412 307).
“Rogers is a technology leader in providing materials-based solutions in many different application areas, and we will enforce our patent rights to protect our substantial investment in innovation,” said Robert C. Daigle, Senior Vice President and Chief Technology Officer of Rogers Corporation.
DBC substrates are electrically insulating and thermally conductive industrial ceramics to which copper foil has been directly bonded. The result is a metallized ceramic substrate with high thermal conductivity, superior heat spreading capability and low thermal expansion properties, all of which are essential for high performance power electronics applications.
Investor Contact: William J. Tryon, Director, Investor and Public Relations
Phone: 860-779-4037
FAX: 860-779-5509
Email: william.tryon@rogerscorp.com
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, safety and protection applications as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
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