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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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Rogers Files Patent Infringement Lawsuits Against KCC
December 7, 2015 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation, today announced that its wholly owned subsidiary, Rogers Germany GmbH, has filed two separate patent infringement lawsuits in Mannheim, Germany against KCC Corporation of Seoul, Korea and its German subsidiary KCC Europe GmbH with its registered office in Cologne. In these two complaints, Rogers alleges that KCC infringes a Rogers patent by offering in Germany direct bonded copper (DBC) substrates that were manufactured using a process that is patented in Germany (European Patent No. 1 412 307).
“Rogers is a technology leader in providing materials-based solutions in many different application areas, and we will enforce our patent rights to protect our substantial investment in innovation,” said Robert C. Daigle, Senior Vice President and Chief Technology Officer of Rogers Corporation.
DBC substrates are electrically insulating and thermally conductive industrial ceramics to which copper foil has been directly bonded. The result is a metallized ceramic substrate with high thermal conductivity, superior heat spreading capability and low thermal expansion properties, all of which are essential for high performance power electronics applications.
Investor Contact: William J. Tryon, Director, Investor and Public Relations
Phone: 860-779-4037
FAX: 860-779-5509
Email: william.tryon@rogerscorp.com
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, safety and protection applications as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
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