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Advanced Electronics Packaging Digest

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proteanTecs, GUC Expand Custom SoC Health Monitoring Collaboration

09/23/2026 | BUSINESS WIRE
proteanTecs®, the leading provider of health and performance management solutions for advanced electronics, and Global Unichip Corporation (GUC), a leading advanced ASIC and IP services provider, announced an expansion of their strategic collaboration.

TM Soldering Solutions Launches Selective Soldering Process Development Lab

09/22/2026 | TM Soldering Solutions
TM Soldering Solutions, the re-born successor to selective soldering pioneer ACE Production Technologies, announces the opening of a new Selective Soldering Process Development Lab in the company’s Spokane Valley production facility, it is announced.

Nordson Test & Inspection to Unveil SonoFlex Acoustic Inspection System at SEMICON West 2026

09/21/2026 | Nordson Test & Inspection
Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence™ Ecosystem at SEMICON West 2026, October 13–15, in Booth 5844 at the Moscone Center in San Francisco, California.

BAE Systems Launches Shadow EW Compact Electronic Warfare Solutions

09/18/2026 | PRNewswire
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Infineon to Sell NOR Flash and F-RAM Business to Winbond, Focus on Core Growth Areas

09/17/2026 | Infineon
Infineon Technologies AG announced that it has entered into a definitive agreement under which Winbond Electronics Corporation, a Taiwan-based global supplier of semiconductor memory solutions, will acquire Infineon’s NOR Flash and F-RAM business in an all-cash transaction valued at $1.12 billion on a cash and debt free basis.
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