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Behind the Scenes with IPC Technical Conference Coordinator Toya Richardson
December 9, 2015 | Patty Goldman, I-Connect007Estimated reading time: 9 minutes
Richardson: I don't. I can tell you that Kristin Scheuler, who is in charge of the conference rooms and setting all of that up for the venue, is doing a wonderful job. Kristin always does a great job with our rooms. She always amazes me when we need something like an extra room.
Goldman: That's great. It's funny you said that you don't really have any time off. I always thought that with it happening in March you would get a little break afterward, but I know that in June we're already starting to solicit papers for the next year. There really isn't any spare time, is there?
Richardson: No. There's always a back portion to it that our attendees do not see. We have to put together the call for papers. I look at that and make sure that it says what it's supposed to say and the deadlines meet what they are supposed to meet. Are we adding new topics? Are we taking any away? Are we changing names in terms of who to contact and things of that nature? That has to be done and it's a back-and-forth process before we actually put it out. Then once we put it out, we're thinking right away, “Now where are the abstracts?” All of that still takes place before June.
I'm very excited about the upcoming (IPC APEX EXPO) show, because I've never been at this venue before. This will be fun, exciting, and as always, challenging.
Goldman: Sounds good. It's always a pleasure talking with you.
Richardson: Thank you so much.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.