-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
MacDermid’s Research Team Talks New Cyanide-free Immersion Gold at SMTAI
December 14, 2015 | Patty Goldman, I-Connect007Estimated reading time: 8 minutes
Nable: Exactly. We put it out there to show it to the industry and say, “Yes, we do have an alternative. If you're willing to work with us, come and talk to us in person.”
Goldman: That helps, especially if they ask their PCB supplier, "Could you use this?" I think that would be beneficial for you and MacDermid.
Nable: We've done our rigorous testing, but of course, everything can’t be done in our labs. We need to get out into the real world and qualify it there. That hasn't happened just yet, but there is interest and there have been talks, but in the very early stages.
Santos: We're in the stage of marketing it and letting the customer know the benefits and performance similarities with the existing cyanide-based finish.
Goldman: A chance to work with them and see what questions they have about it. About how long does it take to get the proper amount of thickness?
Nable: Just to give you a perspective, for ENIG applications it deposits about two micro-inches of gold in about ten minutes, which is similar to that with cyanide versions.
Goldman: So, it's not a time-saver, not that it would be, but with the reduced waste treatment, improved safety, and the lower temperature—these are all important things. And even their customers would be interested in the cyanide-free part, I would think.
Santos: Yes, because they pay a lot of money for the waste treatment, permit application, etc.
Goldman: We talk about value-add processes and, of course, waste treatment is not considered value-add. It's an extra expense. So, to reduce the extra expense is very important. And Cherry, you have your own poster?
Santos: Yes, I have a poster on immersion tin. Immersion tin is not a new process. It's been around for years and has been successfully used as a final finish for the automotive industry.
Goldman: Not as glamorous. Not as pretty as gold.
Santos: No (laughs). The challenge for immersion tin is the deterioration of solderability performance after heat treatment. As it goes through heat treatment, it loses thickness due to the formation of copper-tin intermetallic compound between the tin finish and the Cu metal substrate. For this to be solderable, there has to be a free tin layer left after the heat process because the copper-tin IMC has inferior solder wetting. We just listened to a talk that discussed the different final finishes, and there is no ideal finish. There is no perfect finish.
Page 2 of 4
Suggested Items
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.
iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita
09/09/2024 | iNEMIiNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.
Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
09/09/2024 | Indium CorporationIndium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.
Eutect Overcomes Panel Soldering Challenges with New Gripper
09/06/2024 | Eutect GmbHThe selective soldering of assemblies in panels is not a real challenge. However, if you need to solder relatively large panels with towering components, specialists like those at Eutect GmbH have to step up to the plate.