Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
MacDermid’s Research Team Talks New Cyanide-free Immersion Gold at SMTAI
December 14, 2015 | Patty Goldman, I-Connect007Estimated reading time: 8 minutes
Santos: There is none that fits everything. It depends on the application, the end-use environment, which finish you need for a specific application. The talk also mentioned that there should be at least 0.1 micron of metallic tin after the reflow cycle, which is a pre-treatment process that the immersion tin goes through. So, that is exactly my poster: The reflow effect on the immersion tin solder wetting.
We also went to another talk given by George Milad about IPC thickness requirements. He mentioned that for the tin finish to be solderable after two reflow cycles, you need at least one micron of immersion tin to begin with to have free-tin at the end of the reflow cycle, so that it would still be solderable.
Goldman: And your immersion tin achieves that?
Santos: Yes. So, it's comparable to what competitors have.
Nable: This study also contributes to the understanding of how the immersion tin finish changes with thermal exposure. We wanted to dig a little bit deeper into the mechanism of how immersion tin changes.
Goldman: Surface finishes are of interest to the audience here.
Nable: Right. And that's what we do at MacDermid. We both work in the electronics solutions division and our projects particularly are more focused on final finish, surface finish type of projects. But we're not limited to that.
Goldman: Anything else going on?
Nable: I also want to share that I am a volunteer officer for our local chapter in Connecticut for SMTA, so this is really nice to be able to participate in SMTAI and meet people, and meet the other chapter officers as well. This is the international conference, so this is where all chapters might come together.
Santos: Jun is actually the president of the SMTA Connecticut chapter.
Nable: I am. We try to organize activities or meetings that would be of benefit and relevant to our members that we can all learn from. We get ideas from SMTAI, having these technical talks to gauge the current issues and level of interest in certain topics. We try to bring that back to our local chapter because not all of our members can come to SMTAI.
Santos: The venue of previous SMTA Connecticut chapter expo and forum is just five minutes’ walk from our Waterbury, Connecticut site and fairly accessible to all local members.
Page 3 of 4
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.