Autonomous Trends will Radically Change the Automotive Industry Landscape
December 14, 2015 | Yole DéveloppementEstimated reading time: 3 minutes
- Numerous partnerships, acquisitions and joint ventures in software, self-driving technology …
- The involvement of Tesla within the electric vehicles industry
- The new role played by the leaders of the consumer electronic area
To be fully autonomous, a car needs numerous sensors including radar sensors (short and long range), ultra-sonic sensors, cameras (visible, NIR , LWIR ), LIDAR ) and dead reckoning sensors... According to Yole’s analysts, the “autonomy pack” that will be found in 2030 costs today between US$ 10,000 and US$ 15,000, and will decrease for the next 10 years leading to a strong adoption.
“The technologies are available but important improvement must be clearly done to reduce costs, especially LIDAR and high-end GPS costs” confirms Dr Eric Mounier, Senior Technology & Market Analyst, MEMS & Sensors at Yole.
By 2045, Yole is expecting 29 sensors to ensure the full autonomy of the vehicle. Indeed the number of sensors strongly increases prior to the sensor fusion stage, where sensors will be full exploited: long range radar, surround camera and ultrasonic sensors are part of the vehicle between 2010 and 2015; between 2020 and 2045, Yole’s analysts identify much more sensors and so new functionalities… “The sensor modules volumes will present a 17% CAGR growth between 2015 and 2030”, details Dr Guillaume Girardin, Technology & Market Analyst, MEMS & Sensors at Yole.
Under this analysis, Yole listed 5 different levels of autonomy between 2012 and after 2040. Additional functionalities at every level have been also determined by Yole’s team. For example, in 2022 (level #3), Yole forecasts the following functionalities: Park Assist – Adaptive Cruise Control – Lane Keeping Assist – Lane Departure Warning System already in place since 2015. Plus Autonomous Emergency Braking, Driver Monitoring, Traffic Jam Assist. At this level, a car will embed for US$2,200 of sensors (ADAS only): it combines ultrasonic, radar LRR and radar SRR, long distance camera, camera surround, stereo camera, microbolometer, LIDAR and dead reckoning… And more. About 29 sensors have been identified at level #3, against 6 sensors at the level #1 (before 2012).
“This increasing number of sensors will benefit to the equipment makers but also to the semiconductor companies,” says Dr Mounier from Yole. “With more than 650 million units per year by 2030, automotive supply chain will face many challenges and will experience a tough battle.”
Page 2 of 2Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.