Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Alpha Talks Challenges of Solder Recycling
December 22, 2015 | Patty Goldman, I-Connect007Estimated reading time: 13 minutes
Fullerton: I joke that it's the evil that we know versus the evil we don't know. We have a very good handle on the life cycle of tin-lead solder based on research and historical usage. We have not even 10 years doing lead-free. We still don't have that 30, 40, 50-year life cycle product that has actually been in the field long enough to see how those react.
Goldman: Like those airplanes.
Fullerton: Right, exactly. Those segments still stay with tin-lead because they can quantify the reliability and they can plan around that. With the lead-frees, the long, long term reliability still hasn't been proven out, pro or con. Those industries are afraid of the unknown. They'd rather quantify it and plan around it, so that's where they still live.
Goldman: When you need the ultimate reliability, you stick with what you know that has the reliability.
Fullerton: Yep, I want the airplane that takes me home to Philadelphia tomorrow to have the most reliable solder possible.
Goldman: And I don't care about anything else.
Fullerton: Exactly.
Goldman: Wonderful. Well, thanks for stopping by Jason.
Fullerton: No problem. Thanks for having me.
Page 3 of 3Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.