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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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2015’s Most Read PCB News Items
June 7, 2016 | I-Connect007Estimated reading time: 2 minutes

Infineon Acquires 9.4% Stake in Schweizer Electronic
By investing into Schweizer, Infineon emphasizes its intention to jointly develop technologies for the integration of power semiconductors into PCBs and to tap the chip embedding market for high-power automotive and industrial applications.
Lenthor Achieves ISO 9001:2008 Re-certification
Lenthor Engineering, Inc. has successfully completed its corporate ISO 9001:2008 re-certification. The re-certification audit was performed at lenthor’s new 55k sq/ft corporate facilities in Milpitas, CA.
Isola Unveils New Technical Education Series
Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit Boards (PCBs), today announced the launch of a new technical education Series (TES) to address the increasingly important role of laminate materials in the overall process of system-level design.
N.A. PCB Book-to-Bill Ratio Strengthens
“Although North American PCB sales continued slightly below last year’s levels in February, bookings strengthened,” said Sharon Starr, IPC’s director of market research, “This increased the bookto-bill ratio,” she added. “The ratio has been in positive territory for the past five months, which is a positive indicator for sales growth in the first half of 2015.”
Invotec Acquisition Strengthens Amphenol’s Global Capabilities
The acquisition of Invotec, one of the global leaders in flex and flex-rigid PCB manufacturing, strengthens Amphenol’s global capabilities and product offering in the defense, industrial and aerospace industries.
Sparton Acquires Hunter Technology Corporation
Sparton Corporation announced that its wholly owned subsidiary, Sparton Hunter Corporation, completed a merger with Hunter Technology Corporation in a $55 million all-cash transaction. The merger is subject to certain and conditional post-closing adjustments.
Key PCB Makers Strategize to Meet Industry Demands
The computer/peripheral application is expected to witness the highest growth followed by the communication applications. Top industry players are going for partnership and strategic alliances to deliver unique solutions and to meet the constantly changing industry demands of customers.
Isola’s New Laminate Mitigates Skew in High Speed Designs
Isola Group today announced the introduction of Chronon, the company’s latest ultra-low loss, high-speed laminate and prepreg materials engineered to mitigate skew issues in high-speed designs that have differential pairs.
IPC Honors Volunteers for Contributions to the Industry
IPC presented committee leadership, distinguished committee Service, and Special recognition awards at IPC APEX EXPO at Mandalay Bay convention center in Las Vegas, Nevada. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.