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2015’s Most Read PCB News Items
June 7, 2016 | I-Connect007Estimated reading time: 2 minutes

Infineon Acquires 9.4% Stake in Schweizer Electronic
By investing into Schweizer, Infineon emphasizes its intention to jointly develop technologies for the integration of power semiconductors into PCBs and to tap the chip embedding market for high-power automotive and industrial applications.
Lenthor Achieves ISO 9001:2008 Re-certification
Lenthor Engineering, Inc. has successfully completed its corporate ISO 9001:2008 re-certification. The re-certification audit was performed at lenthor’s new 55k sq/ft corporate facilities in Milpitas, CA.
Isola Unveils New Technical Education Series
Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit Boards (PCBs), today announced the launch of a new technical education Series (TES) to address the increasingly important role of laminate materials in the overall process of system-level design.
N.A. PCB Book-to-Bill Ratio Strengthens
“Although North American PCB sales continued slightly below last year’s levels in February, bookings strengthened,” said Sharon Starr, IPC’s director of market research, “This increased the bookto-bill ratio,” she added. “The ratio has been in positive territory for the past five months, which is a positive indicator for sales growth in the first half of 2015.”
Invotec Acquisition Strengthens Amphenol’s Global Capabilities
The acquisition of Invotec, one of the global leaders in flex and flex-rigid PCB manufacturing, strengthens Amphenol’s global capabilities and product offering in the defense, industrial and aerospace industries.
Sparton Acquires Hunter Technology Corporation
Sparton Corporation announced that its wholly owned subsidiary, Sparton Hunter Corporation, completed a merger with Hunter Technology Corporation in a $55 million all-cash transaction. The merger is subject to certain and conditional post-closing adjustments.
Key PCB Makers Strategize to Meet Industry Demands
The computer/peripheral application is expected to witness the highest growth followed by the communication applications. Top industry players are going for partnership and strategic alliances to deliver unique solutions and to meet the constantly changing industry demands of customers.
Isola’s New Laminate Mitigates Skew in High Speed Designs
Isola Group today announced the introduction of Chronon, the company’s latest ultra-low loss, high-speed laminate and prepreg materials engineered to mitigate skew issues in high-speed designs that have differential pairs.
IPC Honors Volunteers for Contributions to the Industry
IPC presented committee leadership, distinguished committee Service, and Special recognition awards at IPC APEX EXPO at Mandalay Bay convention center in Las Vegas, Nevada. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.