2015’s Most Read SMT News Items
December 29, 2015 | I-Connect007Estimated reading time: 2 minutes
Sparton Acquires Hunter Technology Corporation
Sparton Corporation announced that its wholly owned subsidiary, Sparton Hunter Corporation, completed a merger with Hunter Technology Corporation in a $55 million all-cash transaction. The merger is subject to certain and conditional post-closing adjustments.
Strategically located in the Silicon Valley, the 100,000-square-foot Blue Sky Center features Jabil’s intelligent digital supply chain toolset called Jabil in Control, factory-of-the-future technologies, stateof-the-art IoT and rapid prototyping labs, as well as access to advanced capabilities for increasing customer collaboration and product innovation.
Scanfil Expects Growth Momentum to Continue in 2015
Scanfil expects its turnover to increase by 2–8% in 2015. More turnover is generated in the second half than in the first half of the year. The company believes that its turnover will decrease slightly in the first half of the year, and particularly in the second quarter, compared to 2014. Its operating profit before non-recurring items for 2015 is expected to be EUR 13–17 million.
Zentech Manufacturing Acquires Colonial Assembly and Design
The acquisition provides tremendous synergy with Zentech’s established customer set in the DOD and military C4ISR (Command, Control, Computers, Communications, Intelligence, Surveillance, Reconnaissance) sectors while also providing enhanced engineering, product design, circuit design, machining, over-molded cable assembly and wire harnessing capabilities to the Zentech portfolio.
Page 1 of 2
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.