Graphene Proves a Perfect Fit for Wearable Devices
December 30, 2015 | University of ManchesterEstimated reading time: 2 minutes
Dr Hu, from the School of Electrical and Electronic Engineering, said: “This is a significant step forward – we can expect to see a truly all graphene enabled wireless wearable communications system in the near future.
“The potential applications for this research are huge – whether it be for health monitoring, mobile communications or applications attached to skin for monitoring or messaging.
“This work demonstrates that this revolutionary scientific material is bringing a real change into our daily lives.”
Co-author Sir Kostya Novoselov, who with his colleague Sir Andre Geim first isolated graphene at the University in 2004, added: “Research into graphene has thrown up significant potential applications, but to see evidence that cheap, scalable wearable communication devices are on the horizon is excellent news for graphene commercial applications.”
Page 2 of 2Suggested Items
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
06/17/2025 | Shane Whiteside -- Column: American Made AdvocacyWith the addition of RTX to PCBAA’s membership roster, we now represent the interests of companies in the entire PCB ecosystem. From material providers to OEMs, the insights of our collective members help us educate, advocate, and support legislation and policy favorable to America’s microelectronics manufacturers. The industry veterans who lead these companies provide valuable perspective, and their accumulated wisdom makes us an even stronger association.