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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
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2015’s Most Read SMT Articles
December 31, 2015 | I-Connect007Estimated reading time: 2 minutes
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads is discussed.
A Review of the Opportunities and Processes for Printed Electronics
In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.
Advanced Printing for Microelectronic Packaging
The concept of dispensing a wide range of materials in three dimensions presents a potential change in electronic packaging. This article covers the concept of combining dispensing technologies on a single platform to build integrated and monolithic electronic structural circuits.
Reliability Study of Bottom Terminated Components
This article series discusses bottom terminated components (BTC), and the stress and strain on these components when it comes to solder joints. In Part 1, the authors look at the impact of large voids at the thermal pads of BTC components and their impact on solder joint reliability.
How to Streamline PCB Thermal Design
Thermal issues with a PCB design are mostly determined during the component selection and layout phases. John Parry of Mentor Graphics discusses how addressing thermal issues early in PCB design, starting at the system or enclosure level, can help streamline the entire process.
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
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