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Nano Dimension Files Patent for Printing Multimaterial 3D Objects
January 6, 2016 | Nano DimensionEstimated reading time: 1 minute
Nano Dimension, a leading printing electronics company in the area of 3D printing, announced today that Nano Dimension Technologies, a fully owned subsidiary of Nano Dimension, has filed a patent application with the U.S. Patent and Trademark Office for the printing of 3D models, which includes electronic conductors.
The company has developed an innovative approach to print objects in 3D that contain conductive traces – a process the new patent would cover. Nano Dimension was able to make this new technological development as a result of its work developing materials and 3D printers for multilayer PCB prototyping.
The sintering of a printed metal conductor within a 3D printed polymer allows for complex connectors to be 3D printed and also makes it possible to 3D print molded connectors directly onto electronic circuits. The newly developed process may also be applied to 3D printing of non-flat electronic circuits as well as structural objects with embedded electronic circuits.
The materials and processes required for 3D printing objects containing semiconductors may result in a significant breakthrough for the industry, enabling the creation of freeform electronic products that cannot be created using current circuit manufacturing technologies.
About Nano Dimension
Nano Dimension, founded in 2012, focuses on development of advanced 3D printed electronics systems. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multi-layer PCBs (printed circuit boards) and advanced nanotechnology-based conductive and dielectric inks.
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