SMTA Capital Chapter to Host First Meeting of 2016 on January 27th at DfR Solutions

Estimated reading time: 2 minutes

The SMTA Capital Chapter is pleased to announce its first meeting of 2016 on January 27^th, scheduled from 5:00 pm to 7:00 pm at DfR Solutions, 9000 Virginia Manor Road, Suite 290, Beltsville, MD 20705. The focus of this chapter meeting will be “Test Plan Development – How to Do It!” presented by Dr. Gil Sharon, DfR Solutions.

Testing (a.k.a. environmental testing, accelerated life testing, design verification, product validation, etc.) is considered the default method for ensuring quality and reliability before product launch. This is especially true for small to medium enterprises (SME) or those organizations that rely on an original design manufacturer (ODM) model. And yet, the establishment of a test plan, with the appropriate sequencing (what test should be in series? what should be in parallel? what should be combinatorial?) and test parameters, is often crafted through a combination of gut feel, prior experience, and a cursory review of industry standards. This approach, while understandable, can often lead to confusion and delay when failures occur. And without a clear delineation to the field environment, test success may not mean field success at the customer level.
In this presentation, Dr. Sharon will provide a clear and concise process for developing test plans for electronic products and systems. The presentation will walk through the best practices in test plan development, which includes:

• Developing a Customer Persona
• Capturing all Environmental Stressors
• Defining Limits (95th percentile? 99th percentile?)
• Identifying Synergistic Effects
• Incorporating Physics of Failure
• Determining Sample Size
• Case Studies

Dr. Gil Sharon is a Senior Application Engineer at DfR Solutions.  Dr. Sharon’s research focus is on mechanical reliability of electronic systems and components, multidisciplinary reliability of complex electro mechanical systems, characterization and modeling of material behavior, physics of failure of electromechanical and MEMS systems, and mechanical performance of flip chip packages.  His doctoral research included solder reliability, MEMS structures characterization, embedded components failure analysis, and particle beam accelerator mechanical fatigue.  Dr. Sharon’s experience at Amkor Technology included analysis of chip-package interactions and senior engineer in the advanced product development group.  Dr. Sharon received his Ph.D. in Mechanical Engineering at the University of Maryland.

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