Tunable Materials Clear the Way for Advanced Optics
January 19, 2016 | University of Wisconsin-MadisonEstimated reading time: 3 minutes
Now you see it, now you don’t. In books and movies, wizards use magic spells to make the visible see-through.
In reality, materials with properties called phase transitions can pull off a similar trick, changing from clear to cloudy depending on the temperature or application of an electric field.
A multi-institutional team of researchers has developed a way to precisely engineer the temperatures at which vanadium dioxide — a material used in high-tech applications ranging from homes to satellites — will undergo phase transition. Their work, published today in the journal Nano Letters, could lead to new types of tunable materials for optics, camouflage and thermal regulation.
“Essentially, any optical component would be better if it were tunable,” says Mikhail Kats, senior author of the study and a University of Wisconsin–Madison professor of electrical and computer engineering.
Rather than relying on mechanical components to focus a camera lens or telescope eyepiece, a tunable material could change its innate optical properties on demand.
Scientists have known for more than 50 years that substances like vanadium dioxide can transition between opaque and transparent. However, these materials typically switch under only one particular set of conditions, limiting their applicability.
“In most phase-transition materials, the change occurs at conditions that are far from room temperature, and thus are difficult to incorporate into useful devices,” says Kats.
The researchers not only changed vanadium dioxide’s intrinsic shift point from 155 degrees Fahrenheit to below 70 degrees, they successfully tuned the transition for that material across a variety of specific temperatures — ranging from typical indoor comfort to medium-rare hamburger.
“This finding is going to open up new frontiers in photonic devices,” says collaborator Shriram Ramanathan, a professor of materials engineering at Purdue University.
Page 1 of 3
Suggested Items
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.