-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Smart Sonic Launches Automatic Ultrasonic Stencil & Pallet Cleaner
January 19, 2016 | Smart SonicEstimated reading time: 1 minute
With the strong dollar impacting international sales, Smart Sonic has invested time and resources into lowering the cost of the next generation stencil cleaners. The New Model 6100 comes fully loaded with the most popular options and CE certification yet the selling price is almost 20% less than its predecessor.
The Model 6100 maintains the overall appearance and function of the 6000 series, but the new manufacturing strategies set in place have allowed for dramatic cost reductions. Prior to the Model 6100, Smart Sonic would build each machine to order according to the customer’s specifications. Now, by equipping each machine with the most popular options, the Model 6100 can be fabricated in larger lots providing significant savings in materials and reduced labor. A win-win for the customer and Smart Sonic.
The Model 6100 is the “workhorse” of the Smart Sonic line of ultrasonic stencil & pallet cleaners. Able to clean 29” x 29” stencils in less than 2 minutes, the Model 6100 can also clean wave solder pallets, oven radiators, misprinted PCBs and associated tooling used in the SMT printing process.
Like all Smart Sonic Stencil & Pallet Cleaners, the Model 6100 is compatible with Smart Sonic’s exclusive EnviroGuard 100% Closed-loop Technology and 440-R SMT Detergent, the only VOC-free stencil cleaning chemistry.
The Standard Model 6000 will still be offered to allow customization for unique applications. The Smart Sonic Stencil Cleaning Process is verified for specific parameters of environmental safety, user safety and cleaning efficiency by the U.S. EPA’s Environmental Technology Verification Program and is guaranteed to clean any type of SMT solder paste from any fine-pitch stencil! For additional information go to www.SmartSonic.com or visit us at APEX 2016 in Booth #2304.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.