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Molex Completes Acquisition of Teramount Ltd.
05/07/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
IBM, Aramco Explore Collaboration to Accelerate AI and Innovation Across Saudi Arabia
05/07/2026 | IBMAramco and IBM announced their intended collaboration on opportunities to advance artificial intelligence, agentic AI, automation, material science and other mutually agreed domains in the industrial sector.
Foxconn Launches Second-Gen LEO Satellite, Begins Inter-Satellite Link Testing
05/05/2026 | FoxconnFoxconn Technology Group, the world's largest electronics manufacturing services provider, announced that its second-generation low-Earth orbit (LEO) satellites, "Pearl-1A" and "Pearl-1B," were successfully launched into their designated orbits via SpaceX's Falcon 9 rocket on the evening of May 3 (Taipei time).
AdvancedPCB Advances Precision Drilling Capabilities Across Two U.S. Facilities with Schmoll
05/05/2026 | AdvancedPCBAdvancedPCB has completed the installation of two Falcon small-hole drilling systems from Schmoll Maschinen GmbH at its U.S. facilities in Maple Grove, Wisconsin and Santa Clara, California.
GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module
05/04/2026 | GlobalFoundriesGlobalFoundries (Nasdaq: GFS) (GF) announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).