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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Nordson Electronics Solutions to Showcase Dispensing and Plasma Systems at SEMICON West 2026

09/25/2026 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will feature two new systems designed to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications.

Technica USA Participates at NEDME

09/24/2026 | Technica USA
Technica USA, along with key supply partners DCT and Inovaxe, participated this week in the Northwest Electronics Design & Manufacturing Expo (NEDME) in Hillsboro, Oregon.

KYZEN to Highlight AQUANOX Cleaning Chemistries and Longer Bath Life at SMTA International

09/23/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at SMTA International, scheduled to take place October 27-29 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

Koh Young Hires Brent Johnson as Western Regional Sales Manager

09/22/2026 | Koh Young America
Koh Young America has hired Brent Johnson as Western Regional Sales Manager, adding an experienced SMT manufacturing professional with firsthand knowledge of Koh Young inspection technology to its sales team

LPMS USA to Highlight Local Supply and Simplified Electronics Protection at SMTA Guadalajara

09/17/2026 | LPMS USA
LPMS USA, a leading provider of integrated low pressure molding solutions for electronics protection, will exhibit at the SMTA Guadalajara Expo & Tech Forum, October 7–8, 2026, at Expo Guadalajara.
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