-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Opens Moscow Branch
February 2, 2016 | Rehm Thermal SystemsEstimated reading time: 1 minute
Rehm Thermal Systems is expanding its operations in Russia in order to offer customers comprehensive product consultation and rapid service locally, while taking the best advantage of new potential in the market. The specialist in thermal system solutions for the electronics and solar industry opened its own branch in Moscow in December 2015. Before that, a distributor was responsible for looking after its Russian customers.
The new branch in Russia means that Rehm can respond even faster to individual customer wishes and current development trends. Mikhail Kuzhelev will be responsible in Moscow for supporting and consulting with Rehm customers on site. Thanks to his expertise, he is available for all sales queries and for details concerning process and facility technology.
For the past few years, Kuzhelev was a senior process engineer at a Russian electronics service provider, which offers global customers solutions for manufacturing and testing memory modules, microprocessors and other electronic components. He was involved in the enhancement of manufacturing technologies and strategic fault management. Kuzhelev was also an expert contact partner in the area of reflow soldering, assisting them with troubleshooting, and in doing so gaining valuable experience in avoiding soldering errors. He will now be applying this know-how gainfully for Rehm customers in Russia.
"Progress means both development and change. The electro-industry constantly demands new solutions with a high level of innovation. Rehm has the international electronics market very precisely in its sights and is at the cutting edge with its comprehensive product portfolio. I'm especially looking forward to personally consulting with our Russian customers on the latest soldering and coating technology and assisting them as Rehm's direct contact partner," Kuzhelev comments.
Suggested Items
IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.