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New CEO Jeff Waters Outlines his Roadmap for Isola
February 8, 2016 | Barry Matties, I-Connect007Estimated reading time: 26 minutes
Matties: Speed obviously is the big issue, and optical is becoming probably the next logical step. How do you see that or have you given that much consideration yet?
Waters: From a performance requirement, optical has been comprehended into the product development plans that we have. If I look at some of the noise or loss targets that we have with some of our products that are in development, like our Tachyon® 100G product, for example, what I've seen when I’ve looked at the capabilities, is that we have an ability to stay ahead of where that market is going to be, so we should be able to maintain a leadership position there.
Matties: You want to definitely be in the leadership position because it's changing so fast. The speed barriers that we thought were there are being breached almost by the minute. It's incredible how fast this stuff is moving these days.
Waters: There's a great example where if you are just looking at optical from a Shenzhen perspective or from a San Jose perspective only, you're going to miss some of the nuances. The fact that we've got a presence on both sides of the Pacific, and then even on the other side of the United States with the Alcatel-Lucents of the world, and then, heck, even if you go on over to the Swedish part of the world, we've got a footprint there. Once again, if the employees feel like they've got the power and the voice, we should be able to stay ahead of where that market is if we do our jobs right.
Matties: Sounds like you're on a good path. You have great experience that you're bringing to the table and time will tell. We will see what you can do.
Waters: I've already lasted a week and a half so... [Laughing]
Matties: I don't know if that's record or not, but congratulations [Laughing]. Thank you so much for the interview.
Waters: You as well.
Page 6 of 6Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.