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Alpha’s Corné Hoppenbrouwers to Present at the EPP Innovations Forum in Boblingen
February 15, 2016 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will present its high reliability solutions for Automotive Assembly Applications at the 4th EPP Innovations Forum on Thursday 10th March, in Böblingen, Germany.
Alpha’s presentation which will be given by Corné Hoppenbrouwers, Sales and Technical Support Manager for Central Europe, and will focus on solder alloys for Automotive Applications, including fatigue resistant alloys such as InnoLot for under hood applications and low silver, low temperature alloys for inside the cabin.
“Alpha’s range of high operating temperature automotive assembly solutions which use the InnoLot alloy provide stronger solder joints that can withstand the harsh operating conditions of the engine bay. For the In-Cabin area of vehicles, Alpha’s innovative SBX02 low temperature solder alloy can provide the solution to cutting down on assembly costs by enabling the use of low cost, lightweight PET flex circuitry”, comments Steve Brown, Director of Automotive OEM Marketing, Alpha Assembly Solutions.
The 4th EPP Innovations Forum will focus on high mix/low volume production, with the events main aim to transfer knowledge and improve competitiveness for electronics in Germany. The event will bring together a number of key industry professionals who will each give a 20 minute talk. There will also be breaks throughout the day for networking opportunities.
To register for the event click here.
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