The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
ESI Launches Newest Addition to Laser Micromachining Portfolio
February 17, 2016 | ESIEstimated reading time: 2 minutes
Electro Scientific Industries, Inc., an innovator of laser-based manufacturing solutions for the micromachining industry, today introduced the Garnet adaptable laser micromachining platform for high-volume cutting, marking, drilling or engraving applications. Garnet complements ESI’s current micromachining portfolio delivering lower cost of ownership specifically for China manufacturers’ need for larger format materials. The Garnet™ platform’s 300x300mm stage allows manufacturers working with large-format materials to optimize production and service for a wider range of customer needs.
The Garnet™ platform is positioned between the Lumen™ platform, ideal for high-end prototyping and production applications where precision and flexibility are paramount, and the lower-cost Jade™ platform, introduced earlier this year for less demanding general purpose laser machining applications.
The Garnet™ platform drives down total cost of ownership by combining ESI’s engineering expertise with China’s manufacturing cost advantages. To meet the market’s wide range of application needs, Garnet™ is built on a versatile base frame capable of multiple laser engine and optics combinations. The Garnet™ platform can be configured and delivered rapidly to meet the short product ramp times of contract manufacturers in China.
“Manufacturers of larger format components in consumer electronics, automotive and soft goods markets have the same range of application needs and pressures to lower their cost of ownership as those manufacturing smaller components in the consumer electronics market,” said Mantreh Nournia, General Manager, Micro Machining Division, ESI. “To meet these market needs and increase manufacturer’s capabilities on large-format materials, we launched the Garnet™ platform as the third system in our micromachining series and ESI’s second system built on a low-cost China platform. Garnet™ extends our expertise with the Jade™ and Lumen™ platforms to address a broad set of laser material interaction applications at a very attractive cost of ownership.”
The Garnet™ platform includes many capabilities found in high-end prototyping tools including superior configuration flexibility, compound beam motion control and the highest levels of precision in the industry for this class of product. Garnet™ lowers overall cost of ownership with a 25 percent jump in placement accuracy compared to other mid-range laser systems.
About ESI
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim.
Share on:
Suggested Items
Rogers Announces Addition of Woon Keat Moh to Board of Directors
12/23/2024 | Rogers CorporationRogers Corporation announced that Woon Keat Moh ("Moh") has been appointed as an independent member of the Company’s Board of Directors, effective January 1, 2025. Following this change, the Board will be composed of nine members, eight of whom are independent.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
Coherent Evaluates Strategic Alternatives for Its Advanced Lithium-Ion Battery Recycling Technology
12/13/2024 | Globe NewswireCoherent Corp., a global leader in materials, networking, and lasers, today announced that as a result of an ongoing strategic portfolio assessment, the company will evaluate strategic alternatives for its Streamlined Hydrometallurgical Advanced Recycling Process (SHARP™) technology to efficiently recover and recycle critical metals from lithium-ion batteries (LiBs).
Battery Prices Stabilize in November, Slight Increase Expected in 2025
12/12/2024 | TrendForceTrendForce’s latest research reveals that China's EV sales continued to grow throughout November 2024, driving demand for EV batteries. LFP battery prices remained stable, while prices for ternary batteries saw a slight decline.