Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
ACE to Conduct March 9 Selective Soldering Workshop in Indianapolis
February 18, 2016 | ACE Production Technologies Inc.Estimated reading time: 2 minutes
ACE Production Technologies, Inc., a leading supplier of selective soldering systems, lead tinning systems and lead tinning services, is pleased to announce that it will co-host a selective soldering workshop in Indianapolis in conjunction with DIVISYS International, LLC.
The workshop will be held Wednesday, March 9, 2016 at DIVSYS International, 8110 Zionsville Road in Indianapolis, Indiana. This technical workshop will include a classroom process training session followed by a Q&A session and one-on-one discussion after the workshop is concluded.
Who Should Attend
- Process Engineers
- Manufacturing Engineers
- Production Technicians
- Quality Personnel
What They Will Learn
- How to improve your selective soldering effectiveness
- Programming tips and tricks
- How to reduce selective soldering defects
- Advanced process troubleshooting techniques
- How to reduce post-solder rework and increase yields
This classroom session focuses on the technical aspects of the selective soldering process and describes the process variables to enhance the flexibility, reliability and quality provided by all types of selective soldering equipment. Your questions about using a selective solder process, and differences in process parameters when working with tin-lead and lead-free solder alloys will be answered during this course. Topics Include:
- Fundamentals of through-hole soldering
- Solderability issues
- Lead-free and tin-lead solder alloys
- Flux deposition and flux activation
- No-clean processing
- Design guidelines
- Quality measurement
- Process troubleshooting guidelines
- Process optimization methods
This workshop entitled “Mastering Selective Soldering Processing and Manufacturability” features a combination of classroom curriculum and hands-on training that is designed to educate and enhance an attendee’s working knowledge of the overall selective soldering process. This workshop will be presented by well-known process expert Bob Klenke, Principal Consultant with ITM Consulting. He has more than 15 years of direct hands-on experience with selective soldering technology and is a frequent instructor for selective soldering, wave soldering and X-ray inspection workshops at APEX and SMTA International conferences.
This highly informative workshop is offered at no cost to all attendees courtesy of ACE Production Technologies and DIVSYS International and covers all aspects of the selective soldering process. For more information about this selective soldering workshop, or to register for the workshop, contact Tammie Fish at tammie.fish@divsys.com or call 317-405-9427, Ext. 1004.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, click here, call 509-924-4898 or email sales@ace-protech.com.
About DIVSYS
DIVSYS International, LLC is a supply chain manager of printed circuit boards with lab assurance testing of every lot in Indianapolis before shipment to the customer. DIVSYS’s fully equipped lab offers a complete range of testing services for both bare and assembled printed circuit boards. DIVSYS is comprised of technical experts in both bare and assembled boards, who have over 170 combined years of “hands-on” experience with bare board fabrication and all aspects of board assembly. This concentration of knowledge is what DIVSYS uses to assure quality printed circuit boards to meet or exceed customer requirements. This is why military, automotive, medical device and other high reliability environments are a key niche market for DIVSYS. For more information, visit www.divsys.com, call 317-405-9427, Ext. 1004 or email sales@divsys.com.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.