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SEHO to Demo Flexible SelectLine-C at WIN Eurasia
February 19, 2016 | SEHO Systems GmbHEstimated reading time: Less than a minute
SEHO Systems GmbH, through its Turkish representative KMC-Grup, will showcase the SelectLine-C selective soldering machine in Hall 8, Booth G-150 at WIN Eurasia, which is scheduled to take place from March 17-20, 2016 at the Tuyap Fair Convention & Congress Center in Istanbul, Turkey.
SEHO continues to release new technologies to ensure higher productivity in electronic productions with flexible and innovative machines. All selective soldering systems from SEHO feature a comprehensive hardware and software package to ensure 100 percent automatic process control.
Two electro-magnetic soldering units for mini-wave or dip processes may be integrated into the SelectLine-C. Two new and unique features that are patented by SEHO ensure a remarkable increase in productivity: The automatic ultrasonic nozzle cleaning function guarantees reliable processes and maximum machine availability, and the Synchro software feature nearly doubles production volume without major investments.
The SelectLine-C machine concept is consistently modular, thus ensuring clear cost benefits. The fluxer module, various preheat modules and soldering modules as well as a brush and AOI station may be equipped individually, and depending on the requirements, they can be configured into a complete manufacturing line.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.