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Advanced Electronics Packaging Digest

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Nordson EFD to Preview New Dispensing Technologies for Medical Device Assembly at COMPAMED 2026

11/06/2026 | Nordson
Nordson EFD, a Nordson company, announced that trade show attendees will get the first look at two new dispensing technologies, the Ultimus AccuFlow™ and PICO Pµlse® XP HV, at COMPAMED 2026, November 16–19 at the Düsseldorf Exhibition Centre in Düsseldorf, Germany.

DENSO Supports Next-Generation Mobility Talent Through EcoCAR Challenge

11/05/2026 | PRNewswire
DENSO, a leading mobility supplier, is sponsoring the EcoCAR Innovation Challenge, a four-year collegiate engineering competition that prepares students to become future leaders in mobility, technology and innovation.

Arcline-Backed Signia Aerospace to Acquire Heads Up Technologies

11/04/2026 | PRNewswire
Signia Aerospace, a portfolio company of Arcline Investment Management, has entered into a definitive agreement to acquire Heads Up Technologies, a portfolio company of JLL Partners.

FSQuality Circuits to Exhibit at electronica 2026 in Munich, Germany

11/03/2026 | FSQuality Circuits
Thailand-Based Advanced PCB Manufacturer to Showcase High-Density Interconnect Technology, High-Layer-Count PCBs, and China-Plus-One Global Manufacturing Solutions.

Fraunhofer IPMS Showcases New Technologies for the Future of Semiconductor Industry

11/03/2026 | Fraunhofer IPMS
At SEMICON Europa 2026, the Fraunhofer Institute for Photonic Microsystems IPMS will showcase current research results and technological developments for the semiconductor industry.
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