The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
ViTrox to Debut New SPI System and V-One Solution at IPC APEX EXPO 2016
February 24, 2016 | ViTrox TechnologiesEstimated reading time: 1 minute
ViTrox Technologies will exhibit its V310 3D SPI and V-One at the upcoming IPC APEX EXPO 2016, which scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center.
ViTrox's 3D Solder Paste Inspection (SPI) is designed for paste print inspection, which is applicable to different fields such as mobile phones, tablet PCs, computers and accessories, digital cameras, camcorders, automotive electronics, medical electronics, and servers, to name a few. The V310 3D SPI system inspects PCB boards up to 510mm x 505mm and can accurately detect defects quickly. Its Programmable Spatial Light Modulation (PSLM) eliminates the mechanical operation and moving parts, greatly improving the ease of use and reliability, and reducing the maintenance costs compared to other solder paste inspection technologies available in the market. The patented D-Lighting achieves full light spectrum detectability, which aims to solve the shadow effect and reduce noise interference during 3D measurement.
ViTrox's V-One is the new software-based product launched by ViTrox that combines all of the previous and future ViTrox software into one suite of solutions to connect the inspection machines in SMT production lines in order to monitor their performance on a real-time basis. V-One allows users to manage factories smarter and optimize factory resources across geographical locations.
ViTrox Technologies will be at Booth 1023.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.