Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Happy’s Essential Skills: Problem Solving
February 24, 2016 | Happy HoldenEstimated reading time: 4 minutes
Table 1. 8-Step Problem Resolution Process
Table 2. 7-Step Problem Resolution Process
All of these processes emphasize the need to understand why the issue is occurring under one set of circumstances but not another, and to consider more than one possible root cause. Regardless of which process is used, the customer should require a systematic approach to problem solving from the supplier to avoid these pitfalls:
- Poorly defined and characterized problem
- Rapid convergence on a single root cause without considering others
- Confusion about who is working on the resolution
- Failure to segregate suspect material
- Poor verification of root cause or solution
- No schedule to track deliverables for verification
- No leverage of knowledge or defects discovered on similar products
There is often some urgency to find and resolve the issue, and the sourcing team should be wary of quick solutions proposed by the supplier without thorough analysis. The supplier may propose additional testing and inspection on their side to check for defects and prevent future escapes, but the sourcing team should push for permanent process changes to prevent defects from occurring in the first place. Finally, the corrective action request should not be considered closed until improvement has actually been measured and noted by the customer. A corrective action plan is not the same thing as the successful implementation of that plan.
Failure to promptly or successfully resolve an issue is a serious matter that could jeopardize the relationship between a supplier and a customer, particularly for repeat occurrences of the same issue. The sourcing team should closely monitor supplier investigations and their implementation of corrective action plans. Although any failure to meet customer requirements is a concern, issues will happen from time to time, and a supplier who takes swift and effective action on behalf of the customer can still be considered a valued partner.
My next column is on DOE. This was my secret weapon for problem solving when I first encountered printed circuit process problems. Further reading and resources is the ASQ, American Society for Quality[2] . Villanova University has a number of on-line six-sigma and Agile courses and certificates[3].
References
- Kepner-Tregoe: www.kepner-tregoe.com
- ASQ: www.asq.org
- Villa Nova University www.villanovau.com
Happy Holden has worked in printed circuit technology since 1970, with Hewlett-Packard, NanYa/Westwood, Merix, Foxconn and Gentex. He is the co-editor, with Clyde Coombs, of the Printed Circuit Handbook, 7th Ed. To contact Holden, click here.
Page 2 of 2Share on:
Suggested Items
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
Smarter Machines Use AOI to Transform PCB Inspections
06/30/2025 | Marcy LaRont, PCB007 MagazineAs automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.