International Conference on Soldering and Reliability (ICSR) Program Announced
February 24, 2016 | SMTAEstimated reading time: 1 minute
The SMTA is pleased to announce the program for the 10th Annual International Conference on Soldering and Reliability being held May 9-11, 2016 in Toronto, Canada. The event is co-located with the SMTA Toronto Expo.
The technical conference features presentations on topics including Bismuth-Containing Solders, Micro Solder Technologies, Production Assembly Processes, Soldering Processes, Polymeric Materials, Reliability, and Conformal Coating. Speakers represent companies including BAE Systems, Celestica Inc., Honeywell International Inc., IBM Corporation, and Rockwell Collins, and schools including Binghamton University, University of Maryland-CALCE-EPSC, University of Seoul, University of Toronto, and University of Waterloo.
Michael Osterman, Ph.D., CALCE/University of Maryland, will deliver the Keynote Presentation "Remaining Issues with Pb-Free Electronics" on Tuesday, May 10.
Workshops on Monday, May 9, will include:
- Shining a Light on LED Technology: Construction, Reliability, Qualification, Failure Modes Process Material
- LGA and QFN Component Technology: Manufacturing Implementation and Solder Joint Reliability
- Designing in Reliability by Assessing Contamination at the Component Interface
The SMTA Toronto Expo and Tech Forum will run in conjunction with the ICSR program on Tuesday, May 10. Conference participants may attend the expo for no charge. Complimentary technical presentations will be offered. Check online for more details and the agenda.
The Early Bird registration deadline is April 8th. For more information or to register here.
Contact Jenny Ng at 952-920-7682 or jenny@smta.org with questions.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Advancements in Inkjet Technology With Electra Polymers
04/14/2025 | Real Time with...IPC APEX EXPODon Monn from Electra Polymers discusses the evolution of inkjet technology since 2016, focusing on market changes and the reliability of inkjet products. He explains the additive inkjet process, which reduces waste and boosts efficiency. The conversation highlights Electra Polymers' strong market presence in North America and the importance of customer trust.
Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections
04/11/2025 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.
Electra's ElectraJet EMJ110G Powers Seamless Transition at Sunrise Electronics
04/11/2025 | Electra Polymers LtdElectra, in partnership with Allen Woods Associates, is proud to announce the successful deployment of its ElectraJet® EMJ110G Soldermask on KLA’s Orbotech Neos™ platform, now running production at Sunrise Electronics in Elk Grove Village, Illinois.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Capital Expo & Tech Forum
04/11/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on May 8 at George Mason University – Mason Square in Arlington, Virginia.
Best Papers from SMTA International Announced
04/10/2025 | SMTAThe SMTA is pleased to announce the Best Papers from SMTA International 2024. The winners were selected by members of the conference technical committee. Awards are given for "Best of Proceedings" as well as "Best Practical and Applications-Based Knowledge" categories. A plaque is given to primary authors of all winning papers for these exceptional achievements.