-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Alpha to Present LED Technical Papers at Upcoming 2016FLEX Conference
February 25, 2016 | Alpha Assembly SolutionsEstimated reading time: 3 minutes
Alpha Assembly Solutions will participate in the 2016 FLEX Conference & Exhibition taking place February 29 to March 3 in Monterey, California.
Presented by FlexTech Alliance, the event draws various electronics professionals as they discuss the latest breakthroughs and developments in Flexible, Printed and Hybrid Electronics. Alpha’s Ravi Bhatkal and Nicholas Herrick, will be presenting technical papers in the Interconnect and FHE Technology sessions.
The paper by Ravi Bhatkal, titled “Flexible, Formable Interconnects for 3D Circuits,” focuses on a novel stretchable, formable interconnect technology for LED, sensor and other component integration in 3D and out of plane molded circuits.
The paper by Nicholas Herrick titled “Evaluating the Thermal, Electrical and Optical Characteristics of Mid-power LEDs Assembled with Traditional and High Reliability Solder Alloys on Flexible Circuits”, presents a structured study to understand LED performance at a range of operating currents by measurement of junction temperature, thermal resistance, total luminous flux, color-correlated temperature (CCT), efficacy, and wall plug efficiency, for a given solder alloy.
Additional information:
2016 FLEX Conference & Exhibition
February 29 – March 3, 2016
8AM – 5PM PST
Monterey Marriott
350 Calle Principal
Monterey, CA 93940
Wednesday, March 2, 2016
Session 17: Interconnect 2, 3:55PM – 5:40PM
Flexible, Formable Interconnects for 3D Circuits
By: Ravi Bhatkal – Alpha Assembly Solutions
Wednesday, March 2, 2016
Session 15: FHE Technology, 3:55PM – 5:40PM
Evaluating the Thermal, Electrical and Optical Characteristics of Mid-power LEDs Assembled with Traditional and High Reliability Solder Alloys on Flexible Circuits
By: Nicholas Herrick – Alpha Assembly Solutions
For more information on ALPHA LED materials, visit our site or send an email to: Amit D. Patel – Project Management Engineer, Energy Technologies, Amit.Patel@AlphaAssembly.com.
About Strategies in Light
Strategies in Light has been the world’s largest and most comprehensive LED and lighting event in North America for the past 15 years. The event is designed to connect key suppliers and service providers with influential industry decision makers. More than 5,000 LED and lighting professionals attend this this show for face-to-face networking and benefit from unprecedented access to industry’s most anticipated platform for lead generation and new business development. For more information, visit www.strategiesinlight.com.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Company, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.