-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ALPHA Products to be Showcased by ERMEG at the Amper Show in the Czech Republic
February 29, 2016 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will have its latest innovative products showcased by its Premium Distributor for the Czech and Slovak Republics, ERMEG Ltd, at the Amper show in Brno, Czech Republic on the 15th- 18th March 2016.
Alpha’s extensive range of electronics assembly solutions will be presented at the show including ALPHA SNCX Plus 07 no-silver, lead-free solder alloy. The product has been engineered to minimize copper dissolution as compared to silver-bearing alloys and improve total cost of ownership. SNCX Plus™ 07 solder alloy provides excellent production yields, superb solder ability due to the fast wetting speed and low dross generation. It can be used for across a wide range of soldering processes.
Furthermore Alpha will presents its latest cored wire and solder paste products including Telecore HF-850 cored solder wire and OM-535 solder paste. ALPHA Telecore HF-850 is the fastest wetting and lowest spattering, Halogen and Halide Free cored wire from Alpha’s cored wire range. Telecore HF-850 provides excellent first pass solder joints and is suitable for use in any electronic or industrial no-clean soldering application.
ALPHA OM-535 is a low temperature solder paste designed to enable a single reflow application for assembly of double sided boards. OM-535 version with SBX02 alloy has a melting point of below 140°C and provides excellent mechanical strength and drop shock resistance. The product enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through-hole components are used, this can significantly lower the total cost of ownership.
Alpha Assembly Solutions have enjoyed a long partnership, with ERMEG Ltd distributing Alpha products across the Czech and Slovak Republics. In 2015, ERMEG Ltd became part of Alpha’s exclusive Premium Distributor Council.
For more information on Alpha Assembly Solutions’ product offering please visit ERMEG Ltd at the Amper show in Brno, Czech Republic, Booth# P2 - 14 or go to the Alpha Assembly Solutions Website.
About ERMEG Ltd.
ERMEG Ltd supplies materials, special products and technologies for the electrical and electronic industry in the Czech and Slovak Republics. Founded in 1990 and located in Liberec, ERMEG provides comprehensive customer service including the supply of components, related technologies and expert applications advice to a large range of leading international companies.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit AlphaAssembly.com.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.