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Inventec Intros Enhanced Co-Solvent for Challenging Defluxing Applications
February 29, 2016 | Inventec Performance ChemicalsEstimated reading time: 1 minute
Inventec Performance Chemicals has expanded its line of Topklean co-solvent agents with the release of the Topklean EL20P, which has been designed in response to the latest defluxing needs of today's electronics.
Formulated to have an outstanding capillary action by taking into consideration two main parameters: the penetration coefficient and the solvency power, the new product features a high wetting performance, allowing it to efficiently clean lead free fluxes after reflow, which are hard to remove.
For almost two decades, the Topklean EL 20 product range from Inventec Performance Chemicals has been the best-in-class co-solvent agent to be used mixed or separated with HFEs (hydrofluoroether) in vapour phase cleaning systems to remove solder flux residues, before application of conformal coatings, underfills or wire bonding process.
The cleaning action to remove baked-on solder flux residues after reflow, also known as defluxing, from PCBs and power semiconductors has become more and more challenged because of the higher densities in today's electronics, miniaturization, lower stand off components, and complex geometries. This situation becomes even more difficult in lead free assembly where higher process temperatures are applied causing charring to flux residues.
The new Topklean EL20P features enhanced solvency power to dissolve and remove lead-free flux residues; faster cycle time due to its higher solvency and rinsing capabilities; lower ionic contamination; improved environmental performance, great materials compatibility; and is fully compatible with main vapour phase cleaning systems available in the market.
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