-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Dr. Jennie Hwang to Talk on Preventing Production Defects, Failures at IPC APEX EXPO 2016
March 3, 2016 | Dr. Jennie HwangEstimated reading time: 1 minute
Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments in packaging and assembly and with the goal of achieving high yield and reliability in mind, the “how-to” prevent prevailing production defects and product reliability issues through an understanding of potential causes is a necessity.
On Thursday, March 17, 2016, from 9:00 to 12:00 pm, the professional development course (PD21) at IPC APEX to be held at the Las Vegas Conference Center will address the top six production defects and issues - PCB pad cratering (vs. pad lifting); BGA head-on-pillow defect; open or insufficient solder joints; copper dissolution issue; lead-free through-hole barrel filling; PCB black-pad issue. Specific defects associated with BTCs and PoPs and the reliability of BTC and PoP assembly will also be outlined.
The course provides a holistic overview of product reliability including the important roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. The course addresses the most prevalent production issues and defects that affect yield, cost and reliability, suitable to all who are involved with or interested in SnPb and Pb-free manufacturing including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.
Please join your industry colleagues in this course. The main topics to be covered in this course are listed below. And welcome your questions and issues for solutions and discussions.
Main Topics:
- Premise of production defects and product failure prevention;
- The most common production defects/ issues in lead-free assembly;
- PCB pad cratering (vs. pad lifting) — causes and solutions;
- BGA head-on-pillow defect — causes, factors, remedies;
- Open or insufficient solder Joints – different sources, best practices;
- Copper dissolution — process factors, impact on through-hole joint reliability, mitigation;
- Lead-free through-hole barrel filling — material, process and solder joint integrity;
- PCB black-pad issue – causes, remedies;
- Defects of BTC solder joints - prevention and remedies;
- Defects of PoP solder joints - prevention and remedies;
- Product reliability – principles;
- Product reliability – roles of solder joint, PCB and component considerations;
- Summary – production defects;
- Summary – product reliability.
Register: Click here or Contact: AndreaPinc@ipc.org
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.