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Rehm to Showcase Latest Technologies at SMT/Hybrid/Packaging in Nuremberg
March 7, 2016 | Rehm Thermal SystemsEstimated reading time: Less than a minute
Rehm Thermal Systems will be exhibiting its latest manufacturing solutions at this year's SMT/Hybrid/Packaging show, which will be held from April 26-28 in Nuremberg.
The electronics industry continuously meets new challenges in the processing of sensitive electronic components – from processing the smallest components, the highest standards in void-free solder joints and increased quality through resistance coating, through to safe operation under extreme temperatures. Under the slogan "Power on – switch on and get started!” Rehm will be presenting innovations and new solutions for modern and efficient electronics manufacturing.
Key technologies on display will be the VisionXP+ Vac two-in-one solution for reflow convection soldering; the VisionXC; the CondensoX, which provides reliable reflow condensation soldering; the Protecto with UV dryer, which is suitable for selective conformal coating applications; the Securo; and the RDS magazine dryer.
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