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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4

07/15/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.

Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability

06/26/2025 | MAGNALYTIX
Magnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.

Bridging the Knowledge Gap in Test: A Conversation with Bert Horner

06/11/2025 | Barry Matties, I-Connect007
Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.

IPC Hall of Fame Spotlight Series: Highlighting Bob Neves

06/11/2025 | Dan Feinberg, I-Connect007
Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. This Hall of Fame spotlight features industry veteran Bob Neves, who joined IPC in 1986 and was inducted into the IPC Hall of Fame in 2007.

GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves

06/09/2025 | Gen3
GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.
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