The Shaughnessy Report: A Stack of Advanced Packaging Info
Connect the Dots: Designing for Reality: Strip-Etch-Strip
Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
Stadium’s Shanghai Design Centre Pushes Design-led Growth for Wireless Applications
March 11, 2016 | Stadium GroupEstimated reading time: 1 minute
On 16th February 2016, Stadium’s Board of Directors cut the ribbon to signify the official opening ceremony for its Regional Design Centre (RDC) in Shanghai’s Zhangjiang Hi-Tech Park, China.
In support of the Group’s wider strategy to further develop its design-led technology businesses, the Shanghai RDC has become an International Purchasing Office (IPO) and the Company’s regional research and development hub in wireless M2M connectivity for global OEM products in automotive, medical, security and other growing vertical markets. Driven by the Internet of Things (IoT), which continues to stimulate demand, the M2M space is forecast for high growth.
“The new Shanghai Regional Design Centre is an exciting move for Stadium that both strengthens our wireless capabilities and gives us access into new markets,” said Charlie Peppiatt, CEO, Stadium Group. “We have recruited a highly experienced team, including design engineers and field application engineers, specialising in wireless, RF and M2M technologies. Stadium’s presence in China, delivered by the new Shanghai RDC and manufacturing facility in Dongguan, positions the company to capitalise on a growing market opportunity and expand further into the Asia Pacific market.”
A 210 m² site on the Zhangjiang Hi-Tech Park was selected as the location for Stadium’s RDC office. Located on the Pudong side of the city, this high-tech park is host to a large number of industries including integrated circuits, software, IoT development, biopharmaceuticals, information security, semiconductor illumination and modern agriculture, among others. A significant number of multinationals also have their research and development centres located here. The talent pool in Zhangjiang Hi-Tech Park for electronics engineering and related skills is the best in Asia with a vast pool of experienced skilled doctorates and graduates.
Share on:
Suggested Items
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.
If You Can Define It Right, You Can Design It Right
12/05/2024 | Andy Shaughnessy, Design007Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.