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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Insulectro Brings Power Chats to Booth at IPC APEX EXPO 2016
March 14, 2016 | InsulectroEstimated reading time: 4 minutes
TUESDAY, MARCH 15
10:30 am Printed Electronics 101
Want to learn about Printed Electronics? Give us 13.5 minutes.
Chris Hunrath, Insulectro
11:30 am Tune into High Frequency with Tachyon 100G
Isola’s process friendly low loss, high reliability laminate system.
Norm Berry, Insulectro
1:30 pm Pyralux HT Can Take the Heat
Highest temperature PCB material system available @ 225°C
Glenn Oliver, DuPont & Michelle Walsh
2:00 pm Work Out Your Core with Interra™ FL
Fine lines and low loss layers with high copper adhesion
Glenn Oliver, DuPont & Chris Hunrath, Insulectro
3:00 pm Challenged by High Temperature Lamination?
Take the pressure off with Thermolam™
Combination high temperature conformal and release up to 315°C
Peter Decaneas, Pacothane & Chris Hunrath, Insulectro
3:30 pm Better Bonds, better Profiles, Don’t Let Your Design Get Foiled
Copper foil bond enhancements from Oak Mitsui
John Blaber, Oak-Mitsui & Joe Bevan, Insulectro
WEDNESDAY, MARCH 16
10:30 am Jump on Board and Catch the Design Wave
All about Ormet interconnects.
James Haley, EMD Performance Materials & Chris Hunrath, Insulectro
11:00 am Get Stuck on GliCap
Shikoku’s non-etching innerlayer bonding process
Koji Saeki, Shikoku & Mike Gemanis, Insulectro
1:30 pm Challenged by High Temperature Lamination?
Take the pressure off with Thermolam™
Combination high temperature conformal and release up to 315°C
Peter Decaneas, Pacothane & Chris Hunrath, Insulectro
2:00 pm Tune into High Frequency with Tachyon 100G
Isola’s process friendly low loss, high reliability laminate system.
Norm Berry, Insulectro
2:30 pm Get Out of the Rough and Ditch Pumice Scrub with Glibrite
Shikoku’s copper adhesion process for dry film and soldermask.
Koji Saeki, Shikoku & Chris Hunrath, Insulectro
3:00 pm Focus In on High Yield Imaging Processes
Photoresist matched process chemistries by Focus Tech
Scott Campbell, Focus Tech & Michelle Walsh, Insulectro
3:30 pm Wet Lam to the Rescue on VLP Copper
Process for high yields on fine line innerlayers with VLP copper
William Wilson, DuPont & Mike Gemanis, Insulectro
4:00 pm Pyralux HT Can Take the Heat
Highest temperature PCB material system available @ 225°C
Glenn Oliver, DuPont & Michelle Walsh, Insulectro
THURSDAY, MARCH 17
10:30 am Printed Electronics 101
Want to learn about Printed Electronics? Give us 13.5 minutes.
Chris Hunrath, Insulectro
11:30 am Work Out Your Core with Interra™ FL
Fine lines and low loss layers with high copper adhesion
Glenn Oliver, DuPont & Chris Hunrath, Insulectro
All Power Chats are in Space 534 at IPC APEX EXPO. No sign-up required. For further information, please phone 949-587-3326.
About Insulectro
Insulectro is the leading supplier of PCB and Printed Electronics materials used to manufacture circuit boards. Insulectro combines its premier product offering with local inventory in strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.
Insulectro supplies advanced engineered materials manufactured by DuPont®, Isola, LCOA®, CAC, Inc., Pacothane, Oak-Mitsui, Focus Tech, Shikoku, Kodak, and Coveme. These products are used by our customers to fabricate complex, multilayer circuit boards. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards and printed electronics for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military, and medical.
Page 2 of 2Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.