-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
I-Connect007’s Patricia Goldman Inducted into IPC Hall of Fame
March 15, 2016 | I-Connect007Estimated reading time: 1 minute

The Association Connecting Electronics Industries—IPC—awarded Patricia “Patty” Goldman it’s highest honor, the Raymond E. Pritchard Hall of Fame Award, in recognition of her outstanding contributions and distinguished service to IPC and the advancement of the electronics manufacturing industry. Goldman received her award at a special ceremony today at the opening day of IPC APEX EXPO 2016 in Las Vegas, Nevada, being held at the Las Vegas Convention Center.
Goldman, managing editor of The PCB Magazine, has more than three decades of experience in the PCB industry and has volunteered countless hours to IPC. During this time she has been an active participant in numerous committees and chairman of several, including the Technical Activities Executive Committee (TAEC). Among her past honors, Patty was recognized in 1984 with the IPC President's Award for her contributions to IPC and the industry. She is also the author of numerous technical papers on subjects including bondable gold, pink ring, direct metallization, electrophoretic photoresist and flat glass for improved signal integrity.
“It still seems a little unreal to me because all of the people that have received this—people I have looked up to, that have done so much for the industry and have influenced so much. Several I would consider mentors, including Bernie Kessler, Don Dinella and Dieter Bergman.”
Goldman’s career in PCB manufacturing began as an engineering associate with Western Electric’s R&D center in New Jersey, and includes process engineering, sales and marketing of specialty chemicals (Enthone and OMG/Electrochemicals), electrodeposited resists (PPG), and fiberglass fabric (Dielectric Solutions LLC). In addition to serving as chair of TAEC, Goldman has chaired both the Process Control and Woven Glass Reinforcement TG committees, and she has been an active participant on both the Video Steering and the Technical Program committees.
“I can’t stress enough how important it is to volunteer, to work on a committee or subcommittee. It’s vital that people get involved, and not just sit in a room and listen. Not only can you help write and develop a standard that is important to you, but you can actually participate and have an effect and influence on how things are done and written."
Congratulations Patty!
Suggested Items
Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
05/13/2025 | Prashant Patel -- Column: Facing the FutureInnovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.
Industrial Robotics Market is Set to Surpass Valuation of $235.38 Billion by 2033
05/12/2025 | Globe NewswireThe global Industrial robotics market was valued at US$ 26.99 billion in 2024 and is expected to reach US$ 235.28 billion by 2033, growing at a CAGR of 27.2% over the course of forecast period, 2025–2033.
SEMI Applauds New Bill to Clarify Tax Credit Eligibility for Critical Semiconductor Suppliers Under U.S. CHIPS Act
05/12/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced support of the Strengthening Essential Manufacturing and Industrial Investment Act (SEMI Investment Act), which clarifies that critical materials suppliers to semiconductor manufacturers are eligible for the Advanced Manufacturing Investment Tax Credit (“Section 48D”) created by the United States CHIPS and Science Act.
TT Electronics Secures £50 Million in New Contract Awards for Classified U.S. DoD Defense Programs
05/12/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced today that it has been awarded significant new contracts totalling over £50 million to support classified U.S. Department of Defense (DoD) programs.
I-Connect007 Technical Library: Your Ultimate Free Knowledge Resource
05/12/2025 | Barb Hockaday, I-Connect007I-Connect007’s technical library was created in 2016 with the launch of its first title, "The Printed Circuit Buyer’s Guide to AS9100 Certification." Created to satisfy a need for readily available, free technical resources, the library has become a powerful knowledge hub for the printed circuit board and electronics manufacturing supply chain.