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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Design of Experiments
The third experiment, in Figure 4, serves to find the highest hole quality in a multilayer board. The variables and levels were a full factorial design of four variables at three levels:1. Drill methods: (-) resharpened 4-8 times (0) resharpened
2. Drill diameter: (-) 0.008” (0) .014” (+) 0.020”
3. Infeed rate: (-) xx in. per min. (0) xx in. per min (+) xx in. per min
4. Construction: (-)Std. Foil-Lam (0) Thick-prepreg w/foil-Lam (+) Std. Core-Lam.
The results are the hole quality (rms roughness %) and max. innerlayer mushrooming in microns.
The best quality was 0 microns mushrooming and
The fourth experiment, shown in Figure 4, is to further find the highest hole quality and to look at drilling productivity. The variables and levels were a fractional factorial design of three variables at two levels:
1. Drill method: (-) new drills (+) resharpened 6 times
2. Stack height: (-) 1 high (+) 3 high
3. Panel venting dams: (-) no-flow dams (+) full venting dams
The results are the hole quality (rms roughness %) and max. innerlayer mushrooming in microns.
The best quality was < 4% rms hole-wall roughness using a plane of new drill bits for stacks of 1-high with any appropriate venting dams. Analysis shows that the old resharpened drills could be used with drill stacks 3-high and has a usable hole-wall roughness but it interacts with drill infeed rates.
Figure 4: Two more examples of DOE for hole quality in multilayer boards. Full factorial design on the left was conducted to optimize drilled hole quality. Fractional factorial DOE on the right further optimizes hole quality and production productivity.
Notice that this last experiment was a fractional factorial. The power of a scanning experiment using the fractional factorial methodology is that N number of variables can be reviewed with only N+2 experiments. This is useful to find main effects, but not interaction, while later experiments will provide examination of interactions and optimization.
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