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AIM’s Timothy O’Neill to Present White Paper at Reliability Workshop
March 23, 2016 | AIM SolderEstimated reading time: 1 minute
Timothy O’Neill, AIM’s Technical Marketing Manager, will present his white paper “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing” at a cleaning and reliability workshop on April 12th, 2016 from 1:50pm – 2:40pm at North Carolina State University in Raleigh, North Carolina. The workshop will also be held on April 14th, 2016 in Asheville, North Carolina at Asheville-Buncombe Technical Community College.
O’Neill’s white paper covers the optimization of solder paste performance from receiving to reflow. The discussion topics will include paste handling, stencil design, printer set up and common defects. The presentation incorporates theory with best practice to inform the process engineer of the how, what and why of solder paste use.
Timothy O’Neill has over 20 years of experience in the solder assembly for electronics industry, including extensive knowledge with fine pitch solder paste dispensing technology. He has assisted and solved numerous clients’ production challenges. O’Neill is also a technical writer and presenter for industry trade publications and events.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.
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