The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Speedline Technologies’ MPM Edison Printer Takes an Impressive New Product Introduction Award at APEX 2016
March 25, 2016 | Speedline Technologies, Inc.Estimated reading time: 1 minute
Speedline MPMs’ new Edison printer received the 2016 New Product Introduction (NPI) award in the stencil/screen printing equipment category. Announced by Circuits Assembly at the recent IPC APEX® trade event in Las Vegas, winners were recognized for leading new products in electronics assembly equipment, materials and software.
The award was presented to Speedline Technologies’ Mark Clemons, Business Unit Manager – Printers, during a ceremony on Tuesday, Mar. 15, 2016 that took place at the Las Vegas Convention Center exhibition center in Las Vegas, Nevada during APEX.
The MPM Edison is an innovative new platform of next-generation printers sharing software, controls, and advanced technologies on a scalable platform. Featuring outstanding speed, accuracy, and performance surpassing best-in-class SMT printers worldwide, Edison is built to excel in every way, with patented features throughout its design. Edison operates at twice the speed and 25% higher accuracy than current printers, and delivers an unheard-of higher throughput than competitive printers –15 seconds total throughput, including printing and stencil wipe cycle. Edison delivers double the throughput of best-in-class printers worldwide.
Edison features built-in 8 micron alignment, and 15 micron wet print repeatability (>2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing. This represents a 25% improvement in wet print accuracy over current best-in-class printing machines. Edison performs superbly with SMT Fine Pitch solder paste printing for small apertures (<.3mm CSP’s, 01005’s), and Edison is powered by an intuitive, new software operating system, Intueri, that’s easy to set up and use.
About Speedline
Speedline, a member of the ITW Electronics Assembly Equipment Group (Illinois Tool Works, Inc. (NYSE: ITW), is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. Based in Franklin, Massachusetts, USA, with Electrovert manufacturing based in Camdenton, Missouri, the company markets four best-in-class brands: MPM stencil and screen printing systems; Camalot dispensing systems; Electrovert wave soldering, reflow soldering and cleaning equipment; and Accel microelectronics cleaning equipment.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.