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Ersa to Present New Products at SMT/Hybrid/Packaging 2016
March 29, 2016 | ErsaEstimated reading time: 2 minutes
Ersa GmbH, the largest supplier of soldering equipment, is pleased to announce that it will exhibit a wide range of industry leading technologies in Hall 7, Booth 117 at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. Additionally, the company will exhibit the VERSAFLOW3/45 with VERSASCAN and VERSAEYE for the first time.
The VERSAFLOW 3/45 is the first in-line selective soldering machine with dual track transport. Highest flexibility and highest throughput can be realised with the smallest possible required space. Already an industry favorite, the 3/45 is now equipped with VERSASCAN and VERSAEYE. The VERSASCAN module recognizes multicodes on printed boards, product carrieres or printed boards that are not fully or wrong assembled. These "bad boards" will be excluded from the processing. This saves resources and cycle time and leads to a clearly increased productivity. The VERSAEYE gives information about the solder joint: good or bad. The VERSAEYE is system optimized for wave and selective solding systems, is compatible with work piece carriers, and makes modular inspection possible: bottom, top or bottom & top. VERSAEYE is also available with up to 9 cameras per module.
Also on display at the show, Ersa’s new VERSAFLOW 4/55: the ideal selective soldering system for large and complex board assemblies in electronic manufacturing. Because of its modular design and depending on the demands additional flux, preheat and solder modules can be integrated. All modules run autonomously through their configured programs. Set-up times and operator interventions are not required, so the system can always operate at the highest level of productivity and process flexibility.
Stop by Ersa’s booth to see the Ersa Hotflow 3/20 VOIDLESS, Ersa presents a process efficient solution to minimize the occurrence of voids, which is characterized by its high throughput in inline operation, short process times and low operating costs. The VOIDLESS module, for which no additional maintenance is required, can be activated /deactivated at any time and reduces the occurrence of voids when compared to other soldering processes by up to 98 percent.
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