-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki and Fuji Connect to Improve PCB Manufacturing Productivity and Efficiency
March 31, 2016 | Saki CorporationEstimated reading time: 1 minute

Saki Corporation (SAKI), an innovator in the field of automated optical inspection equipment, proudly announces its participation in Fuji Machine Manufacturing's "FUJI Smart Factory with Nexim" initiative. Saki's inspection and measurement systems will connect with Fuji's pick-and-place machines for a high productivity manufacturing process.
"SAKI is a leading company in the field of inspection solutions towards SMT (surface mount technology) lines," said Shinsuke Suhara, Fuji Managing Executive Officer. "With SAKI's innovative mind from its establishment, SAKI has built up a wide ranging portfolio from solder paste inspection (SPI), 2D and 3D automated optical inspection (AOI), to 3D automated X-ray inspection (AXI) systems, aiming to realize high productivity solutions for all customers. By Fuji standardizing the communication protocol between AOI machines and electronic component mounters, SAKI automated inspection machines can connect to Fuji's Smart Factory with Nexim to create a production placing system that extends beyond the boundaries of corporations. This significantly contributes to the production of high quality products and high OEE (overall equipment efficiency) at user sites."
"SAKI welcomes this cooperation with FUJI, a company we have worked with for many years," said Yoshihiro Akiyama, SAKI Vice President. "By integrating FUJI's pick-and-place equipment with SAKI's inspection and measurement technologies, we can provide our customers with a highly efficient manufacturing process while minimizing cost."
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO 9001:2008 certifications.
Suggested Items
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.