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Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is participating in the upcoming SMTA Monterrey Conference, to be held on April 14th in Mexico, as a technical presenter.
The technical paper, Reducing the Cost of Lead-Free Circuit Assembly Using Low-Temperature Processing, discusses the issues from recent trends post RoHS implementation to remove complex assemblies by eliminating the wave soldering operation. Although this can reduce operating costs, many through-hole components that require wave soldering cannot withstand the reflow temperatures associated with SAC alloys.
Presented by Mitch Holtzer, the session will discuss the use of a low-melting point solder alloy as an alternative to reduce costs. By reducing the peak SMT reflow temperature to 170°C or lower, temperature sensitive through hole components are viable using a low-temperature solder paste in the through-hole process. In addition, the use of lower cost substrates, previously unable to withstand a SAC reflow profile without excessive warpage, can be used effectively.
“This technology has proven effective for flat panel displays and in-cabin automotive applications, such as instrument clusters, infotainment devices and interior adjustment controls”, said Mitch Holtzer, Global Director of Customer Technical Support for Alpha Assembly Solutions. “You need to examine process considerations, electrical and mechanical reliability, and the limitations associated with lead-bearing component finishes in order to determine a true cost-effective solution for complex assemblies.”
Additional information:
Thursday April 14, 2016
Location: Crowne Plaza Hotel (Apodaca)
Blvd. Aeropuerto 171
Parque Industrial Nexxus
Monterrey, NL 66600
14:00 – 15:00
Reducing the Cost of Lead-Free Circuit Assembly Using Low-Termperature Processing
By Mitch Holtzer – ALPHA ASSEMBLY SOLUTIONS
Speaker Biography – Mitch Holtzer
As the Global Director of Customer Technical Service (CTS) for Alpha, Mitch sets direction and provides coordination for the Alpha CTS group in a global capacity. A major focus of this position is to provide strategic support to OEM, CEM and Automotive customers and target accounts. Mitch joined Alpha in 1998 and has progressed through positions of increasing responsibilities in Marketing, Product Management and R&D. He is a graduate of Purdue University with a degree in Chemistry and holds an MBA from Temple University.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information,click here.
