The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Nordson to Showcase Test and Inspection Systems at SMT/Hybrid/Packaging 2016
April 4, 2016 | Nordson DAGEEstimated reading time: 1 minute
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, which is scheduled to take place from April 26-28, 2016 at the Messe in Nuremberg, Germany.
Nordson DAGE is the market leading provider of award winning bond testing equipment and will be showcasing the second generation 4000Plus with camera assist automation which is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages and the 4000 Optima which is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.
MatriX introduces its latest addition to its #-series: The X3# flexible inline system designed for sophisticated high-speed 3D inspection on solder-joint level up to component inspection. This system features 4 advanced inspection technologies all in one: transmission X-ray technology with patented Slice-Filter-Technique (SFT), off-axis technology and 3D SART. These technologies present a flexible solution package for inline inspection of single and double-sided PCB assemblies with high packing density. The state of the art 3D software uses a dedicated number of angle projections for 3D reconstruction and delivers slice images needed for high quality 3D solder joint analysis. Thanks to the algebraic reconstruction method used (Simultaneous Algebraic Reconstruction Technique = SART) it is possible to generate 3D volumes for programmable slicing levels. Up to 6 slice levels can be generated automatically for high-resolution solder joint analyzing.
With its new X3# platform MatriX offers a combination of an optimized test concept with high speed transmission and selectively used 3D technique where needed.
The New FX-940 ULTRA 3D AOI from Nordson YESTECH incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads and co-planarity of chips, BGA’s and other height sensitive devices. The systems’ advanced 3D sensor provides industry leading metrology capabilities and shadow-free imaging at speeds of up to 8X faster than other systems.
Nordson YESTECH’s M1m AOI offering high-speed microelectronic device inspection with exceptional defect coverage will also be showcased. With 3 micron pixel resolution and telecentric optics, the M1m provides complete inspection.
Share on:
Suggested Items
Sikorsky to Demonstrate Flight Autonomy to U.S. Marine Corps
12/16/2024 | Lockheed MartinSikorsky, a Lockheed Martin company has been selected by the U.S. Marine Corps to demonstrate the maturity and capability of the MATRIX™ flight autonomy system.
DARPA Taps Sikorsky to Add Autonomy to U.S. Army-Owned Black Hawk Helicopter
10/18/2024 | Lockheed MartinSikorsky, a Lockheed Martin company, has received a $6 million award from the Defense Advanced Research Projects Agency (DARPA) to install the company’s ALIAS/MATRIX™ flight autonomy system onto the U.S. Army’s experimental fly-by-wire UH-60M Black Hawk® helicopter. Designated MX, the upgraded aircraft will enable the U.S. Army Combat Capabilities Development Command (DEVCOM) to test and evaluate a wide range of autonomy capabilities, from single pilot operation to fully uninhabited flight.
Matrix Announces the Opening of their Equipment Demonstration Room in Mississauga, Ontario
08/16/2024 | Matrix ElectronicsIn the past year Matrix installed a complete equipment process line for dry film imaging at the Matrix Electronics head office in Mississauga, Ontario. Equipment is installed in a newly refurbished area complete with yellow lighting to support dry film lamination and includes the following equipment...
Semidynamics Releases Tensor Unit Efficiency data for its new All-In-One AI IP
06/25/2024 | SemidynamicsSemidynamics, the European RISC-V custom core AI specialist, has announced Tensor Unit efficiency data for its ‘All-In-One’ AI IP running a LlaMA-2 7B-parameter Large Language Model (LLM).
NCAB Acquires Cumatrix BV in Belgium
04/12/2024 | NCAB GroupNCAB Group has acquired 100% of the shares in Cumatrix BV, based in Lommel, Belgium. A country where NCAB has not had a local presence until now.