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Suggested Items

EIPC Summer Conference 2026: AI, Robots, and Historic Vilnius, Lithuania

06/15/2026 | Marcy LaRont, I-Connect007
Historic downtown Vilnius, Lithuania, hosted the sold-out EIPC Summer Conference, June 9–10, where 175 participants gathered at the AC Hotel, including representatives from the Global Electronics Association, FED, and four other industry associations. This year also included representation from 14 European PCB companies, and one—TTM— from the U.S., something that hasn’t happened for quite some time.

EIPC Winter Conference 2026 to Convene in Aix-en-Provence, France

01/05/2026 | EIPC
On the 3-4 February 2026, EIPC will hold their Winter Conference in the Renaissance Aix-en-Provence Hotel, near Marseille, France.

EIPC Winter Conference 2026: Driving the Future of PCB Technology

12/24/2025 | EIPC
On 3-4 February 2026, EIPC will hold their Winter Conference in the Renaissance Aix-en-Provence Hotel, near Marseille, France.

EIPC Technical Snapshot: Sustainability in Electronics Manufacturing

11/06/2025 | Pete Starkey, I-Connect007
EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/20/2025 | Andy Shaughnessy, I-Connect007
It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
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