Research Team Realizes 3-Color Photodetector
April 25, 2016 | Northwestern UniversityEstimated reading time: 1 minute
While infrared waves are available in short, mid, and long lengths, most detection devices are unable to harness all three at the same time.
Now Northwestern University's Manijeh Razeghi and her team have developed a new approach in device design to realize a three-color, shortwave-midwave-longwave infrared photodetector. With the new design, the devices can detect different infrared wavebands by simply varying the applied bias voltage. This could open up a range of potential applications, including infrared color televisions and three-color infrared imaging.
"A device capable of detecting different infrared wavebands is highly desirable in the next generation infrared imaging systems," said Razeghi, Walter P. Murphy Professor of Electrical Engineering and Computer Science in Northwestern's McCormick School of Engineering.
Supported by DARPA, the Army Research Laboratory, Air Force Research Laboratory, and NASA, the team's finding were published on April 7 in Nature Scientific Reports.
Led by Razeghi, the researchers invented and investigated the new design for three-color photodiodes without using additional terminal contacts. The resulting photodetector is based on indium-arsenide/gallium-antimonide/aluminum-antimonide type-II superlattices.
As the applied bias voltage varies, the photodetector sequentially exhibits the behavior of three different colors, corresponding to the bandgap of three absorbers, and achieves well-defined cut-off wavelengths and high-quantum efficiency in each channel.
This new research builds on the Razeghi group's many years of work in Northwestern's Center for Quantum Devices, including the development of the first single-color, short-wavelength infrared photodetector and two-color, shortwave-midwave infrared photodetector based on type-II superlattices.
"I am fascinated by these results," Razeghi said. "The initial success in this demonstration will drive us to the new frontier of infrared detection and imaging technology."
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Accelerating Embedded Innovation: Orthogone Becomes Texas Instruments Design Partner
09/17/2025 | PRNewswireOrthogone Technologies Inc., a leader in advanced embedded systems and FPGA development, is proud to announce its official designation as a Texas Instruments (TI) Design Services Partner.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
American Standard Circuits to Exhibit and Host Lunch & Learn at PCB West 2025
09/17/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again be exhibiting at PCB West 2025 to be held at the Santa Clara Convention Center on Wednesday, October 1, 2025.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.